Semiconductor device
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United States of America Patent
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Jan 16, 2018
Issued Date -
N/A
app pub date -
Jul 26, 2016
filing date -
Mar 15, 2016
priority date (Note) -
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Abstract
Provided herein is a semiconductor device. The semiconductor device includes: a lower conductive pattern; a lower memory string conductive pattern disposed over the lower conductive pattern; a stack of upper memory string conductive patterns, wherein the stack is disposed over the lower memory string conductive pattern; a lower pad pattern extending from the lower memory string conductive pattern; upper pad patterns respectively extending from the upper memory string conductive patterns; a floating conductive pattern disposed under below the lower pad pattern, the floating conductive pattern overlapping the lower pad pattern; and a contact plug coming into contact with the lower pad pattern and overlapping the floating conductive pattern.
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