Semiconductor device including fin structures and manufacturing method thereof
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United States of America Patent
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Jan 16, 2018
Issued Date -
N/A
app pub date -
Oct 4, 2016
filing date -
Sep 4, 2015
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Abstract
A semiconductor device includes device areas where a Fin FET is disposed and a non-device area disposed between the device areas, which includes a dummy structure. The Fin FET includes a fin structure having a well region including a first semiconductor layer, a stressor region including a second semiconductor layer and a channel region including a third semiconductor layer; an isolation region in which the well region is embedded, and from which at least an upper port of the channel region is exposed; a gate structure disposed over a part of the fin structure. The dummy structure in the non-device area includes a first dummy layer formed over the first semiconductor layer and made of a different material from the stressor region, and a second dummy layer formed over the first dummy layer and made of a different material from the channel region.

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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD | 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78 |
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hsiao, Tsung-Chieh | Changhua County, TW | 58 | 71 |
Wang, Sheng-chen | Hsinchu, TW | 149 | 696 |
Yeong, Sai-Hooi | Hsinchu County, TW | 508 | 1349 |
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