Data storage device having multi-stack chip package and operating method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 16, 2018
Issued Date -
N/A
app pub date -
Feb 27, 2017
filing date -
May 10, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is a data storage device including a controller and a multi-stack chip package, and a method of operating a data storage device. The multi-stack chip package includes a first semiconductor chip arranged on a package substrate, a second semiconductor chip arranged on the first semiconductor chip, and a third semiconductor chip is arranged between the first and second semiconductor chips. The controller can control the first to third semiconductor chips by using a feature parameter measured from each semiconductor chip and a target value that may be originally designed by a memory vendor.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully