Packaged semiconductor devices and methods of packaging semiconductor devices
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United States of America Patent
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Jan 16, 2018
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N/A
app pub date -
Mar 7, 2016
filing date -
Dec 10, 2013
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Abstract
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes forming a mask coating over a carrier, coupling an integrated circuit die over the mask coating, and disposing a molding compound around the integrated circuit die. The method includes forming an interconnect structure over the integrated circuit die and the molding compound.
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