Semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jan 16, 2018
Issued Date -
N/A
app pub date -
Jul 28, 2016
filing date -
Jul 29, 2015
priority date (Note) -
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Abstract
Provided is a semiconductor package including a substrate; at least one semiconductor chip mounted on the substrate; a molding element, which is arranged on the substrate and encapsulates the at least one semiconductor chip; and a lattice element, which is arranged inside the molding element, where the lattice element includes a body having a plurality of openings.
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