Method and apparatus for routing die signals using external interconnects
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United States of America Patent
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Jan 16, 2018
Grant Date -
Mar 6, 2014
app pub date -
Mar 14, 2013
filing date -
Aug 31, 2012
priority date (Note) -
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Abstract
Various aspects of an approach for routing die signals in an interior portion of a die using external interconnects are described herein. The approach provides for contacts coupled to circuits in the interior portion of the die, where the contacts are exposed to an exterior portion of the die. The external interconnects are configured to couple these contacts so that signals from the circuits in the interior portion of the die may be routed externally to the die. In various aspects of the disclosed approach, the external interconnects are protected by a packaging for the die.
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