Semiconductor device and method

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United States of America Patent

PATENT NO 9871009
SERIAL NO

15182723

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Abstract

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A semiconductor device and method of manufacturing is provided, whereby a support structure is utilized to provide additional support for a conductive element in order to eliminate or reduce the formation of a defective surface such that the conductive element may be formed to have a thinner structure without suffering deleterious structures.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ho, Ming-Che Tainan, TW 132 1332
Kuo, Hung-Jui Hsin-Chu, TW 427 1983
Lee, Tzung-Hui New Taipei, TW 20 81
Wu, Yi-Wen Xizhi, TW 94 912
Yu, Chen-Hua Hsin-Chu, TW 2207 47923

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