Packaged integrated circuit device with cantilever structure
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United States of America Patent
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Jan 16, 2018
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N/A
app pub date -
Sep 25, 2015
filing date -
Sep 25, 2015
priority date (Note) -
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Abstract
Techniques and mechanisms to facilitate connection with one or more integrated circuit (IC) dies of a packaged device. In an embodiment, the packaged device includes a first substrate coupled to a first side of a package, and a second substrate coupled to a second side of the package opposite the first side. Circuitry, coupled via the first substrate to one or more IC dies disposed in the package, includes a circuit structure disposed at a cantilever portion of the first substrate. The cantilever portion extends past one or both of an edge of the first side and an edge of the second side. In another embodiment, a hardware interface disposed on the second substrate enables coupling of the packaged device to another device.
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