Feeding overlay data of one layer to next layer for manufacturing integrated circuit
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United States of America Patent
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Jan 16, 2018
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N/A
app pub date -
May 3, 2016
filing date -
May 3, 2016
priority date (Note) -
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Abstract
A method of manufacturing an integrated circuit includes the following steps. A substrate including a plurality of exposure fields is provided, and each of the exposure fields includes a target portion and a set of overlay marks. The substrate is exposed to form a first layer lithography pattern on the target portion for the respective exposure field by an exposure system. The overlay of the first layer lithography pattern and the target portion is measured by the set of overlay marks of each exposure field to obtain first overlay data for the respective exposure field by a measuring system. The first overlay data is fed to form a second layer lithography pattern.
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