Semiconductor device and method of manufacturing the same
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United States of America Patent
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Jan 16, 2018
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N/A
app pub date -
Aug 30, 2016
filing date -
Feb 29, 2016
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Abstract
In one embodiment, a semiconductor device includes an insulator. The device further includes a plug provided in the insulator, the plug including a first barrier metal layer and a first conductive layer that is provided on the first barrier metal layer. The device further includes an interconnect provided outside the insulator, the interconnect being provided on the plug and the insulator and including the first barrier metal layer, the first conductive layer and a second conductive layer that is provided on the first conductive layer.
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