CHIP PACKAGE WITH THERMAL DISSIPATION STRUCTURE AND METHOD FOR FORMING THE SAME
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United States of America Patent
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app pub date -
Jul 14, 2016
filing date -
Jul 14, 2016
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Abstract
Structures and formation methods of a chip package are provided. The chip package includes a first package structure including a first semiconductor die that has a first side and a second side opposite thereto. The chip package also includes a package layer partially or completely encapsulating the first semiconductor die, and a conductive feature in the package layer. The chip package further includes a first heat-spreading layer over the first side of the first semiconductor die and a first cap layer on the first heat-spreading layer.
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