Cooling device and device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 16, 2018
Issued Date -
N/A
app pub date -
Mar 17, 2016
filing date -
Mar 26, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Heat dissipaters 120a, 120b are thermally coupled to a memory 220 and a CPU 230 (heat generating components) disposed on a top surface (a first surface) of a substrate 210. A frame 130 is thermally conductive and is attached above the top surface of the substrate 210. Openings 131 are formed in locations corresponding to locations in the frame 130 where the heat dissipaters 120a, 120b are provided. Elastic rubber elements 150 are thermally conductive and flexible, and thermally couple the heat dissipaters 120a, 120b to the frame 130. This configuration is capable of dissipating heat generated by the heat generating components even when the heat generating components generate amounts of heat that exceed the heat dissipation ability of the heat dissipaters thermally coupled to the heat generating components.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully