Thermosetting resin molded article
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United States of America Patent
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Jan 16, 2018
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N/A
app pub date -
Aug 5, 2016
filing date -
Aug 13, 2015
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Abstract
A thermosetting resin molded article including: a metal member; a first thermosetting resin layer containing a chelating agent in an amount of 0.5% by mass or more; and a second thermosetting resin layer containing no chelating agent or containing a chelating agent in an amount of less than 0.5% by mass, in which the metal member, the first thermosetting resin layer, and the second thermosetting resin layer are stacked in this order is provided. A semiconductor device including: a semiconductor element mounted on a substrate and metal members, which are sealed with a sealant, in which the sealant includes: a first thermosetting resin layer stacked on the semiconductor element and the metal member; and a second thermosetting resin layer stacked on the first thermosetting resin layer is also provided.
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