Semiconductor device
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United States of America Patent
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Jan 16, 2018
Issued Date -
N/A
app pub date -
Aug 26, 2016
filing date -
Sep 16, 2015
priority date (Note) -
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Abstract
Provided is a semiconductor device including a semiconductor substrate; a dummy trench that is formed on a front surface side of the semiconductor substrate; an emitter electrode that is formed above a front surface of the semiconductor substrate and includes a recessed portion that is a recess in an outer periphery thereof, as seen in a planar view; a dummy pad that is electrically connected to the dummy trench and has at least a portion thereof formed within the recessed portion, as seen in the planar view; and a dummy wire that electrically connects the emitter electrode and the dummy pad.
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