Method for collective (wafer-scale) fabrication of electronic devices and electronic device
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United States of America Patent
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Jan 16, 2018
Grant Date -
Jan 4, 2018
app pub date -
Jun 26, 2017
filing date -
Jul 1, 2016
priority date (Note) -
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Abstract
Electronic devices are manufactured using a collective (wafer-scale) fabrication process. Electronic chips are mounted onto one face of a collective substrate wafer. A collective flexible sheet made of a heat-conductive material comprising a layer containing pyrolytic graphite is fixed to extend over a collective region extending over the electronic chips and over the collective substrate wafer between the electronic chips. The collective flexible sheet is then compressed. A dicing operation is then carried out in order to obtain electronic devices each including an electronic chip, a portion of the collective plate and a portion of the collective flexible sheet.
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