Wafer level package structure and method of forming same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 16, 2018
Issued Date -
N/A
app pub date -
Dec 31, 2013
filing date -
Dec 31, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An embodiment is a package including a first package component. The first package component including a first die attached to a first side of a first interconnect structure, a molding material surrounding the first die, and a second interconnect structure over the molding material and the first die, a first side of the second interconnect structure coupled to the first die with first electrical connectors. The first package component further includes a plurality of through molding vias (TMVs) extending through the molding material, the plurality of TMVs coupling the first interconnect structure to the second interconnect structure, and a second die attached to a second side of the second interconnect structure with second electrical connectors, the second side of the second interconnect structure being opposite the first side of the second interconnect structure.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2013 Application Filing Year
- H01L Class
- 22267 Applications Filed
- 20713 Patents Issued To-Date
- 93.03 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 3 Citation Count
- H01L Class
- 23.71 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 16, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 16, 2029 |
