Methods for perforating two-dimensional materials using a broad ion field
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 16, 2018
Issued Date -
N/A
app pub date -
Jan 30, 2015
filing date -
Jan 31, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Perforating graphene and other two-dimensional materials with holes inclusively having a desired size range, a narrow size distribution, and a high hole density can be difficult to achieve. A layer in continuous contact with graphene, graphene-based materials and other two-dimensional materials can help promote hole formation. Processes for perforating a two-dimensional material can include exposing to an ion source a two-dimensional material in continuous contact with at least one layer, and interacting a plurality of ions from the ion source with the two-dimensional material and with the at least one layer. The ion source may be a broad ion beam.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2015 Application Filing Year
- H01J Class
- 2290 Applications Filed
- 1843 Patents Issued To-Date
- 80.49 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 15 Citation Count
- H01J Class
- 91.44 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 16, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 16, 2029 |
