Electrical and thermal conductive paste composition and method of reducing percolation threshold and enhancing percolating conductivity using the same
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United States of America Patent
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Jan 16, 2018
Issued Date -
N/A
app pub date -
Mar 10, 2015
filing date -
Mar 11, 2014
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Abstract
An electrical and thermal conductive paste composition includes a wetting agent that is arranged as a conduction promoter. Further, a method produces an electrical and thermal conductive paste composition by using a wetting agent as a conduction promoter or a conductivity promoter. The electrical and thermal conductivity of a conductive particle-filled polymer composite is enhanced by using the wetting agent. Capillary forces exerted by the wetting agent cause a particle-filled polymeric suspension to percolate at a decreased volume fraction into a highly conductive network and enhance the conductivity of the composite. Through a jamming gelation technique, the percolation threshold in the particle filled polymer composite is lowered to as low as 3 volume percent. As a result, the electrical and thermal conductivity of the composite is maintained at a significantly lower filler volume fraction with a reduction of particle filler content of up to 50 weight percent.

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- 15 United States
- 10 France
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- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY | HONGKONG KOWLOON CLEAR WATER BAY CHINA HONG KONG HONG KONG |
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Yuen, Matthew Ming-Fai | Hong Kong, CN | 2 | 4 |
Zhang, Xinfeng | Hong Kong, CN | 14 | 99 |
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