Electrical and thermal conductive paste composition and method of reducing percolation threshold and enhancing percolating conductivity using the same

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United States of America Patent

PATENT NO 9870843
SERIAL NO

15115039

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Abstract

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An electrical and thermal conductive paste composition includes a wetting agent that is arranged as a conduction promoter. Further, a method produces an electrical and thermal conductive paste composition by using a wetting agent as a conduction promoter or a conductivity promoter. The electrical and thermal conductivity of a conductive particle-filled polymer composite is enhanced by using the wetting agent. Capillary forces exerted by the wetting agent cause a particle-filled polymeric suspension to percolate at a decreased volume fraction into a highly conductive network and enhance the conductivity of the composite. Through a jamming gelation technique, the percolation threshold in the particle filled polymer composite is lowered to as low as 3 volume percent. As a result, the electrical and thermal conductivity of the composite is maintained at a significantly lower filler volume fraction with a reduction of particle filler content of up to 50 weight percent.

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Patent Owner(s)

Patent OwnerAddress
THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGYHONGKONG KOWLOON CLEAR WATER BAY CHINA HONG KONG HONG KONG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yuen, Matthew Ming-Fai Hong Kong, CN 2 4
Zhang, Xinfeng Hong Kong, CN 14 99

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