Method and system for detecting defects of wafer by wafer sort
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United States of America Patent
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Jan 16, 2018
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app pub date -
Apr 23, 2015
filing date -
Apr 23, 2015
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Abstract
A method for detecting defects of wafer by wafer sort is introduced. In the method, a wafer sort testing apparatus is used to obtain a DTL or ADART result, wherein a plurality of repaired sites in a wafer is highlighted according to the DTL or ADART result. A plurality of physical locations of the repaired sites is then output. An analysis equipment is used to match the physical locations with a graphic data system (GDS) design layout coordinate of the wafer so as to generate a data correlating with defects at the repaired sites.
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