Heat transfer management apparatuses having a composite lamina
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United States of America Patent
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Jan 16, 2018
Issued Date -
N/A
app pub date -
Jul 25, 2014
filing date -
Jul 25, 2014
priority date (Note) -
In Force
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Abstract
Heat transfer management apparatuses are disclosed. In one embodiment, a heat transfer management apparatus includes a composite lamina having an insulator substrate and a plurality of thermal conductor traces coupled to the insulator substrate, where the plurality of thermal conductor traces are arranged into a first enhanced thermal conduction region and a second enhanced thermal conduction region. The heat transfer management apparatus also includes a heat generating component mount coupled to the composite lamina and a temperature sensitive component mount coupled to the composite lamina and positioned distally from the heat generating component mount. At least one of the plurality of thermal conductor traces is in electrical continuity with the heat generating component mount and the temperature sensitive component mount, and at least one of the plurality of thermal conductor traces is electrically isolated from at least one of the heat generating component mount or the temperature sensitive component mount.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
DENSO CORPORATION | 1-1 SHOWA-CHO KARIYA-CITY AICHI-PREF 448-8661 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Dede, Ercan Mehmet | Ann Arbor, US | 176 | 1306 |
Nomura, Tsuyoshi | Nagoya, JP | 67 | 278 |
Schmalenberg, Paul Donald | Ann Arbor, US | 49 | 462 |
Wang, Kenan | Ann Arbor, US | 2 | 6 |
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