Edge seal for lower electrode assembly
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United States of America Patent
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Jan 16, 2018
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N/A
app pub date -
Jun 20, 2012
filing date -
Oct 20, 2011
priority date (Note) -
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Abstract
A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in an uncompressed state, the band mounted in the groove such that upper and lower ends of the band are axially compressed and a maximum outward bulging of the band is no greater than a predetermined distance.
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