Electroless copper plating compositions

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United States of America Patent

PATENT NO 9869026
SERIAL NO

14332326

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Abstract

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Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.

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Patent Owner(s)

Patent OwnerAddress
DOW GLOBAL TECHNOLOGIES LLC2211 H H DOW WAY MIDLAND MI 48674
ROHM AND HAAS ELECTRONIC MATERIALS LLC455 FOREST STREET MARLBOROUGH MA 01752

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chow, Andy Lok-Fung Tseung Kwan O, HK 4 7
Laitar, David S Midland, US 33 144
Li, Crystal P L Tin Shui Wai, HK 6 11

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