Electroconductive-film-forming composition and method for producing electroconductive film
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United States of America Patent
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Jan 16, 2018
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Jan 21, 2016
filing date -
Jul 29, 2013
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Abstract
An electroconductive-film-forming composition capable of forming an electroconductive film having excellent conductivity and few voids and a method for producing an electroconductive film using the same. The electroconductive-film-forming composition contains copper particles having an average particle diameter of 1 nm to 10 μm, copper oxide particles having an average particle diameter of 1 nm to 500 nm, a reducing agent having a hydroxy group, a metal catalyst including metals other than copper, and a solvent, in which the content of the copper oxide particles is 50% by mass to 300% by mass with respect to the content of the copper particles, the content of the reducing agent is 100 mol % to 800 mol % with respect to the content of the copper oxide particles, and the content of the metal catalyst is 10% by mass or less with respect to the content of the copper oxide particles.
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