Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the same

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United States of America Patent

PATENT NO 9868751
APP PUB NO 20160115184A1
SERIAL NO

14918916

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A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1:

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG SDI CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheon, Jin Min Uiwang-si, KR 13 65
Choi, Jin Woo Uiwang-si, KR 186 769
Chung, Joo Young Uiwang-si, KR 21 17
Kim, Min Gyum Uiwang-si, KR 11 13
Kwon, Ki Hyeok Uiwang-si, KR 6 8
Lee, Dong Hwan Uiwang-si, KR 182 965

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