Molded cavity package with embedded conductive layer and enhanced sealing
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United States of America Patent
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Jan 16, 2018
Issued Date -
N/A
app pub date -
Mar 24, 2016
filing date -
Mar 24, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A base plate with a first side having an elevated portion, a recessed portion laterally surrounding the elevated portion, and a vertical face extending from the recessed portion to the elevated portion is provided. At least a part of the vertical face is covered with a metal layer. A mold compound structure is formed on the first side with the metal layer disposed between the first side and the mold compound structure such that the mold compound structure includes an elevated portion laterally surrounding a recessed portion, and opposing edge faces that vertically extend from the recessed portion to the elevated portion. At least a part of the base plate is subsequently removed such that the recessed portion of the mold compound structure is uncovered from the base plate and such that the metal layer remains on at least one uncovered section of the mold compound structure.
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