Semiconductor device
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United States of America Patent
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Jan 16, 2018
Issued Date -
N/A
app pub date -
Apr 17, 2015
filing date -
Apr 23, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device includes: a semiconductor element; a case; a terminal made of a conductive material and embedded in the case, a part of the terminal being exposed to the outside, having an outermost surface that includes a first film, and having a base portion; a bonding wire that is connected to the first film and electrically connects the semiconductor element and the terminal; and a protection member that is more flexible than the case and covers a contact portion of the terminal contacting with the bonding wire. The first film is removed from an area around the contact portion with the bonding wire in the part of the terminal being exposed to the outside, causing the base portion to be exposed. An exposed portion of the base portion and the protection member adhere to each other.
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