Printed circuit board and package substrate

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United States of America Patent

PATENT NO 9867296
SERIAL NO

14753087

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A printed circuit board includes an insulating substrate, a plurality of pads on a top surface of the insulating substrate, a protective layer formed on the insulating substrate and having an opening to expose top surfaces of the pads, a bump formed on at least one of the pads and protruding upward of a surface of the protective layer. The bump has a curved lateral side.

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Patent Owner(s)

Patent OwnerAddress
LG INNOTEK CO LTDSEOUL

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Dong Sun Seoul, KR 72 463
Lee, Ji Haeng Seoul, KR 28 111
Ryu, Sung Wuk Seoul, KR 19 106
Seo, Hyun Seok Seoul, KR 86 1035

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