Method and system of controlling alloy composition during electroplating
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United States of America Patent
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Jan 9, 2018
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app pub date -
Mar 30, 2017
filing date -
Mar 30, 2017
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Abstract
A method of controlling alloy composition of deposited gold-tin alloy during electroplating of a large panel includes masking at least one planar surface of the panel with conductive material applied in a predetermined pattern. The masked panel is located at least partially within an electroplating solution including a gold-tin alloy in solution at a predetermined gold:tin ratio. Electrical current applied to the masked panel is conducted across the planar surface via the conductive material to induce a predetermined electrical current distribution across the planar surface and thereby pull gold ions and tin ions from the electroplating solution. The pulled ions are deposited upon a supermajority of an unmasked area of the masked panel. The predetermined pattern is selected to achieve deposition of the gold-tin alloy with substantially uniform alloy composition, directly corresponding to the predetermined gold:tin ratio, across the supermajority of the unmasked area of the masked panel.
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