Manufacturing method of semiconductor apparatus, semiconductor apparatus, and endoscope
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United States of America Patent
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Jan 9, 2018
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N/A
app pub date -
Jul 7, 2015
filing date -
Jan 11, 2013
priority date (Note) -
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Abstract
A manufacturing method of an image pickup apparatus includes a step of manufacturing an image pickup device chip, a step of manufacturing a wiring board having first terminals and second terminals disposed on both sides of a first primary surface with a central flexible portion intervened in between, a step of joining a heat conductive block to a second primary surface of the wiring board, a step of joining the image pickup device chip to the first terminals of the wiring board, a step of performing solder joining of core wires of a cable to the second terminals of the wiring board by conducting heat generated by a heat tool through the heat conductive block, a step of bending the wiring board, and a step of performing housing inside a frame member, and sealing with sealing resin.
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