Camera module
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United States of America Patent
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Jan 9, 2018
Issued Date -
N/A
app pub date -
Feb 5, 2013
filing date -
Feb 17, 2012
priority date (Note) -
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Abstract
A camera module of the present invention, provided by adhering a glass substrate to the cover body so that the glass substrate covers an opening of a sensor cover for covering an image pickup element mounted on a wiring substrate, which opening is provided above the image pickup element, the camera module includes: an image pickup package having an internal space provided by the glass substrate, the sensor cover, and the glass substrate; and an image pickup lens provided above the glass substrate of the image pickup package, wherein at least one ventilation groove (G) for allowing the internal space to communicate with open air is provided on an adhesive surface of the glass substrate of the sensor cover.
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