Electrical contact assembly for printed circuit boards

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United States of America Patent

PATENT NO 9865953
SERIAL NO

15646234

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Abstract

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A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fan, Na Shenzhen, CN 5 3
Hu, Jun Shenzhen, CN 339 1717
Huang, Sen Xiong Shenzhen, CN 3 4
Shi, YongDong Shenzhen, CN 2 1
Yin, XiYuan Guangzhou, CN 13 6

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