Package structure with optical barrier, optical package structure and manufacturing methods thereof
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United States of America Patent
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Jan 9, 2018
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app pub date -
Aug 11, 2015
filing date -
Oct 15, 2014
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Abstract
A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.
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