Semiconductor strips with undercuts and methods for forming the same
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United States of America Patent
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Jan 9, 2018
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N/A
app pub date -
Aug 10, 2016
filing date -
Mar 12, 2013
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Abstract
An integrated circuit device includes a semiconductor substrate, and a semiconductor strip extending into the semiconductor substrate. A first and a second dielectric region are on opposite sides of, and in contact with, the semiconductor strip. Each of the first dielectric region and the second dielectric region includes a first portion level with the semiconductor strip, and a second portion lower than the semiconductor strip. The second portion further includes a portion overlapped by the semiconductor strip.
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