Semiconductor device with peripheral void space and method of making the same
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United States of America Patent
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Jan 9, 2018
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N/A
app pub date -
Aug 29, 2016
filing date -
Mar 14, 2016
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Abstract
A semiconductor device includes a first semiconductor region of a first conductivity type on a first electrode and a second semiconductor region of the first conductivity type on a central portion of the first semiconductor region. The second region has a carrier concentration less than a carrier concentration of the first region. A third semiconductor region of a second conductivity type is on the second semiconductor region. A first insulating portion covers a peripheral surface of the second semiconductor region and a peripheral surface of the third semiconductor region. A second insulating portion is spaced from the first insulating portion in a lateral direction. A void space is between the first and second insulating portions. A third insulating portion is on the third semiconductor region and spans and covers the void space. A second electrode is on the third semiconductor region and the third insulating portion.
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