Memory cell structure with resistance-change material and method for forming the same

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United States of America Patent

PATENT NO 9865655
SERIAL NO

14970001

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Abstract

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Semiconductor structures and methods for forming the same are provided. The semiconductor structure includes a substrate and a memory cell structure formed over the substrate. In addition, the memory cell structure includes a first electrode layer formed over the substrate and a resistance-change material layer formed over the first electrode layer. The memory cell structure further includes a second electrode layer formed over the resistance-change material layer. In addition, the resistance-change material layer includes a semimetal or a semimetal alloy.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Colinge, Jean-Pierre Hsinchu, TW 163 5338
Diaz, Carlos H Mountain View, US 267 4411

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