Image sensor pickup region layout

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United States of America Patent

PATENT NO 9865630
SERIAL NO

15206061

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Abstract

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Embodiments of the present disclosure include an image sensor device and methods of forming the same. An embodiment is an image sensor device including a first plurality of pickup regions in a photosensor array area of a substrate, each of first plurality of pickup regions having a first width and a first length, a second plurality of pickup regions in a periphery area of the substrate, the periphery area along at least one side of the photosensor array area, each of second plurality of pickup regions having a second width and a second length.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hung, Feng-Chi Chu-Bei, TW 158 1155
Lin, Jeng-Shyan Tainan, TW 115 1246
Lu, Yan-Chih Tainan, TW 13 227
Wang, Ching-Chun Tainan, TW 141 1241
Yaung, Dun-Nian Taipei, TW 608 6886

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