Package on-package with cavity in interposer
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United States of America Patent
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Jan 9, 2018
Issued Date -
N/A
app pub date -
Aug 5, 2015
filing date -
Mar 12, 2013
priority date (Note) -
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Abstract
A package includes an interposer, which includes a core dielectric material, a through-opening extending from a top surface to a bottom surface of the core dielectric material, a conductive pipe penetrating through the core dielectric material, and a device die in the through-opening. The device die includes electrical connectors. A top package is disposed over the interposer. A first solder region bonds the top package to the conductive pipe, wherein the first solder region extends into a region encircled by the conductive pipe. A package substrate is underlying the interposer. A second solder region bonds the package substrate to the interposer.
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