Methods of manufacturing multi-die semiconductor device packages and related assemblies
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United States of America Patent
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Jan 9, 2018
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N/A
app pub date -
Jun 4, 2015
filing date -
Jul 8, 2014
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Abstract
Methods of making semiconductor device packages may involve attaching a first semiconductor die to a carrier wafer, an inactive surface of the first semiconductor die facing the carrier wafer. One or more additional semiconductor die may be stacked on the first semiconductor die on a side of the first semiconductor die opposite the carrier wafer to form a stack of semiconductor dice. A protective material may be positioned over the stack of semiconductor dice, a portion of the protective material extending along side surfaces of the first semiconductor die to a location proximate the inactive surface of the first semiconductor die. The carrier wafer may be detached from the first semiconductor die.
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