Integrated circuit package with thermally conductive pillar
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United States of America Patent
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Jan 9, 2018
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N/A
app pub date -
Feb 14, 2017
filing date -
Feb 14, 2017
priority date (Note) -
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Abstract
Embodiments of the present disclosure relate to an integrated circuit (IC) package, including a molding compound positioned on a first die and laterally adjacent to a stack of dies positioned on the first die. The stack of dies electrically couples the first die to an uppermost die, and a thermally conductive pillar extends through the molding compound from the first die to an upper surface of the molding compound. The thermally conductive pillar is electrically isolated from the stack of dies and the uppermost die. The thermally conductive pillar laterally abuts and contacts the molding compound.
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