Planarity-tolerant reworkable interconnect with integrated testing
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United States of America Patent
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Jan 9, 2018
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N/A
app pub date -
Apr 25, 2016
filing date -
Feb 22, 2014
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Abstract
A structure includes an electrical interconnection between a first substrate including a plurality of protrusions and a second substrate including a plurality of solder bumps, the plurality of protrusions includes sharp tips that penetrate the plurality of solder bumps, and a permanent electrical interconnection is established by physical contact between the plurality of protrusions and the plurality of solder bumps including a metallurgical joint.
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