Integrated circuit structures with recessed conductive contacts for package on package
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United States of America Patent
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Jan 9, 2018
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app pub date -
Jun 25, 2015
filing date -
Jun 25, 2015
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Abstract
Disclosed herein are integrated circuit (IC) structures having recessed conductive contacts for package on package (PoP). For example, an IC structure may include: an IC package having a first resist surface; a recess disposed in the first resist surface, wherein a bottom of the recess includes a second resist surface; a first plurality of conductive contacts located at the first resist surface; and a second plurality of conductive contacts located at the second resist surface. Other embodiments may be disclosed and/or claimed.
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