Laser ashing of polyimide for semiconductor manufacturing

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United States of America Patent

PATENT NO 9865564
SERIAL NO

14624601

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Abstract

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A system for laser ashing of polyimide for a semiconductor manufacturing process is provided. The system includes: a semiconductor chip, a top chip attached to the semiconductor chip by a connection layer, a supporting material, a polyimide glue layer disposed between the supporting material and semiconductor chip, a plasma asher, and an ashing laser configured to ash the polyimide glue on the semiconductor chip.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cadotte, Maxime Saint-Hyacinthe, CA 3 8
Guerin, Luc Granby, CA 21 195
Truong, Van Thanh Brossard, CA 4 41
Whitehead, Steve Shefford, CA 4 18

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