Methods of forming wire interconnect structures
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United States of America Patent
Stats
-
Jan 9, 2018
Issued Date -
N/A
app pub date -
Oct 20, 2016
filing date -
Jul 17, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.
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Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 23.71 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 9, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 9, 2029 |
