Structure and method for inhibiting cobalt diffusion
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United States of America Patent
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Jan 9, 2018
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app pub date -
Jan 26, 2017
filing date -
Jan 26, 2017
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Abstract
A process for forming a conductive structure includes the formation of a self-aligned, inlaid conductive cap over a cobalt-based contact. The inlaid conductive cap is formed using a damascene process by depositing a conductive layer comprising tungsten or copper over a recessed cobalt-based contact, followed by a CMP step to remove excess portions of the conductive layer. The conductive cap can cooperate with a liner/barrier layer to form an effective barrier to cobalt migration and oxidation.
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