Interconnect structure with misaligned metal lines coupled using different interconnect layer
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United States of America Patent
Stats
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Jan 9, 2018
Issued Date -
N/A
app pub date -
Jan 18, 2017
filing date -
Dec 26, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In some embodiments, an interconnect structure includes first and second metal lines, and an end-to-end portion. The first metal line is formed in a first interconnect layer, extends in length substantially along a first direction and ends at a first end portion. The second metal line is formed in the first interconnect layer, starts from a second end portion, extends in length substantially along the first direction and is misaligned with the first metal line in the first direction. The end-to-end portion couples the first metal line to the second metal line, is formed in a second interconnect layer different from the first interconnect layer, and is overlapped with the first and second end portions. A width of the end-to-end portion at where the end-to-end portion is overlapped with the first end portion is wider than a width of the first end portion by at least about 10%.
First Claim
Other Claims data not available
Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| US | B2 | US9583438 | Dec 22, 2015 |
| DE | B4 | DE102015122667 | Dec 23, 2015 |
| TW | B | TWI600142 | Dec 24, 2015 |
| KR | B1 | KR101780872 | Dec 24, 2015 |
| CN | B | CN105762110 | Dec 28, 2015 |
International Classification(s)
- 2017 Application Filing Year
- H01L Class
- 30754 Applications Filed
- 25260 Patents Issued To-Date
- 82.14 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 30 Citation Count
- H01L Class
- 95.06 % this patent is cited more than
- 7 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 9, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 9, 2029 |
