Interconnect structure with misaligned metal lines coupled using different interconnect layer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 9, 2018
Issued Date -
N/A
app pub date -
Jan 18, 2017
filing date -
Dec 26, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In some embodiments, an interconnect structure includes first and second metal lines, and an end-to-end portion. The first metal line is formed in a first interconnect layer, extends in length substantially along a first direction and ends at a first end portion. The second metal line is formed in the first interconnect layer, starts from a second end portion, extends in length substantially along the first direction and is misaligned with the first metal line in the first direction. The end-to-end portion couples the first metal line to the second metal line, is formed in a second interconnect layer different from the first interconnect layer, and is overlapped with the first and second end portions. A width of the end-to-end portion at where the end-to-end portion is overlapped with the first end portion is wider than a width of the first end portion by at least about 10%.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully