Methods and apparatus for integrated circuit failsafe fuse package with arc arrest
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United States of America Patent
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Jan 9, 2018
Grant Date -
N/A
app pub date -
Dec 30, 2016
filing date -
Dec 30, 2016
priority date (Note) -
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Abstract
In described examples, an apparatus includes: an integrated circuit die having multiple terminals; the integrated circuit die positioned on a die pad portion of a leadframe having leads for external connections, at least some of the leads having an inner portion electrically coupled to at least one terminal of the integrated circuit die; a fuse element coupled between one of the leads of the leadframe and at least one terminal selected from the multiple terminals of the integrated circuit die; and encapsulation material surrounding the integrated circuit die and the leadframe to form a packaged integrated circuit including the integrated circuit die and the fuse element, and having a cavity in the encapsulation material surrounding the fuse element such that the fuse element is spaced from the encapsulation material.
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