Semiconductor module with conductive pin
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United States of America Patent
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Jan 9, 2018
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N/A
app pub date -
Jul 1, 2016
filing date -
Jul 30, 2014
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Abstract
A semiconductor module including a circuit block that has an electrically insulating layer, a plurality of circuit patterns formed on one surface of the electrically insulating layer, and a plurality of power semiconductors mounted on the circuit patterns. The semiconductor module further includes a heat spreader formed on the other surface of the electrically insulating layer, and a capacitor having two electrodes, one of which is electrically connected to at least one of the circuit patterns, and the other of which is electrically connected to the heat spreader.
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