Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation
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United States of America Patent
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Jan 9, 2018
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N/A
app pub date -
Dec 22, 2016
filing date -
Dec 22, 2016
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Abstract
A device comprises a substrate and an adhesive nanoparticle layer patterned into zones of electrical conductance and insulation on top of the substrate surface. A diffusion region adjoining the surface comprises an admixture of the nanoparticles in the substrate material. When the nanoparticle layer is patterned from originally all-conductive nanoparticles, the insulating zones are created by selective oxidation; when the nanoparticle layer is patterned from originally all-non-conductive nanoparticles, the conductive zones are created by depositing selectively a volatile reducing agent. A package of insulating material is in touch with the nanoparticle layer and fills any voids in the nanoparticle layer.
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