Wafers having a die region and a scribe-line region adjacent to the die region

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United States of America Patent

PATENT NO 9865516
SERIAL NO

14992013

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Abstract

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A wafer and a forming method thereof are provided. The wafer has a die region and a scribe-line region adjacent to the die region, and includes a conductive bonding pad in the die region of the wafer and a wafer acceptance test (WAT) pad in the scribe-line region of the wafer. A top surface of the WAT pad is lower than a top surface of the conductive bonding pad.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INC8000 SOUTH FEDERAL WAY BOISE ID 83716-9632

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Yi-Ting New Taipei, TW 20 84
Lee, Tzung-Han Taipei, TW 135 609
Wu, Chun-Yi New Taipei, TW 115 563
Yan, Sheng-Yu New Taipei, TW 1 6

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