Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
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United States of America Patent
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Jan 9, 2018
Issued Date -
N/A
app pub date -
Nov 21, 2013
filing date -
Mar 6, 2013
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Abstract
Method and apparatus for reducing metal oxide surfaces to modified metal surfaces are disclosed. By exposing a metal oxide surface to a remote plasma, the metal oxide surface on a substrate can be reduced to pure metal and the metal reflowed. A remote plasma apparatus can treat the metal oxide surface as well as cool, load/unload, and move the substrate within a single standalone apparatus. The remote plasma apparatus includes a processing chamber and a controller configured to provide a substrate having a metal seed layer in a processing chamber, form a remote plasma of a reducing gas species where the remote plasma includes radicals, ions, and/or ultraviolet (UV) radiation from the reducing gas species, and expose a metal seed layer of the substrate to the remote plasma to reduce oxide of the metal seed layer to metal and to reflow the metal.

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- 15 United States
- 10 France
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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
LAM RESEARCH CORPORATION | 4650 CUSHING PARKWAY FREMONT CA 94538 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Antonelli, George Andrew | Portland, US | 51 | 4094 |
Doubina, Natalia | Portland, US | 2 | 35 |
Duncan, James E | Beaverton, US | 10 | 97 |
Porter, David | Sherwood, US | 85 | 3004 |
Reid, Jonathan D | Sherwood, US | 69 | 2659 |
Spurlin, Tighe A | Portland, US | 21 | 264 |
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